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Zoe SL Chan

Beijing Eswin Computing Technology will start soliciting orders from institutional and public investors on Monday ahead of its Hong Kong initial public offering (IPO), aiming to raise around US$300 million, according to people familiar with the matter.
The Chinese chipmaker had already started gauging investor interest, with trading expected to start on October 8, said one of the people, who asked not to be identified due to the sensitivity of the issue.
The Beijing-headquartered company had earlier passed its listing hearing with bourse operator Hong Kong Exchanges and Clearing, clearing the final regulatory hurdle for a listing in the city.
Citic Securities (Hong Kong) and China Securities (International) Corporate Finance Company are the joint sponsors.
With the listing process ongoing, details such as size and timing may change, the people said.
Eswin Computing Technology’s parent company, Eswin Group, was founded by Wang Dongsheng, founder of flat panel display giant BOE Technology. Wang is widely recognised as the “father” of China’s LCD industry.

The parent group has been spinning off and listing several businesses in recent years. Its 12-inch silicon wafer-producing subsidiary, Xi’an Eswin Material Technology, debuted on Shanghai’s Nasdaq-style Star Market in October 2025 and has a market capitalisation exceeding 120 billion yuan (US$17.9 billion).
Eswin Computing Technology specialises in system-on-chip (SoC) products built on the open-source RISC-V architecture. Its customers are mainly in sectors such as artificial intelligence of things (AIoT) and consumer electronics, according to its IPO filings.
The filing showed that the company remained loss-making. Revenue reached 2.4 billion yuan in 2025, up 20 per cent year on year, but net losses for the year stood at 1.5 billion yuan. Management expects further losses this year due to heavy spending on research and development.
The company said it planned to use proceeds from the IPO to develop new chip products and iterate existing ones, as well as enhance the capabilities of its hardware-software integrated platform. It would also search for potential strategic mergers and acquisitions and further promote the RISC-V ecosystem.


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Revenue reached 2.4 billion yuan in 2025, up 20 per cent year on year, but net losses for the year stood at 1.5 billion yuan


Revenue reached 2.4 billion yuan in 2025, up 20 per cent year on year, but net losses for the year stood at 1.5 billion yuan.


Chinese RISC-V chipmaker Eswin seeks US$300m in Hong Kong IPO ahead of October debut

.css-1c6uqr6{color:inherit;font-weight:inherit;font-size:inherit;font-family:inherit;line-height:inherit;overflow-wrap:break-word;}Revenue reached 2.4 billion yuan in 2025, up 20 per cent year on year, but net losses for the year stood at 1.5 billion yuan

Revenue reached 2.4 billion yuan in 2025, up 20 per cent year on year, but net losses for the year stood at 1.5 billion yuan